Application Case | GEC405U UV Camera in Epoxy Encapsulation Quality Inspection

The core purpose of chip packaging is to provide reliable physical protection for the chip core, offering mechanical protection, electrical interconnections, and thermal dissipation pathways, enabling its safe and convenient application in various electronic devices.

Resin encapsulation centered on epoxy molding compounds has become the mainstream packaging method for consumer and industrial-grade chips due to its combined cost and efficiency advantages. To detect process defects such as resin overflow, voids, and uneven filling, ultraviolet imaging technology—leveraging its unique optical properties—has emerged as a critical technique for ensuring packaging quality.

MindVision's independently developed MV-GEC405U delivers clear, stable visual inspection through ultra-high signal-to-noise ratio and industrial-grade reliability. Its features include:

Ultraviolet Band Enhancement: Optimized for the critical 350-400nm ultraviolet band to maximize contrast between resins and substrates.

Ultra-High Sensitivity and Signal-to-Noise Ratio: With a signal-to-noise ratio exceeding 47dB and ultimate sensitivity surpassing 40V/lux*s, it reliably captures minute signal variations caused by thickness differences. This delivers pure image backgrounds and sharp details.

12-bit Lossless Output: Providing 4096 levels of grayscale detail, it resolves extremely subtle reflectance variations. This capability is essential for converting image grayscale into quantitative thickness data.